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Shenzhen Mukun Trading Co., Ltd
Contact person:Mr. Dong Chengming
Tel:86 0755 89689959
Fax:86 0755 33620169
Postal code:518111
Address: No.107, Building M22, Hardware Chemical Plastic Zone, China South City Holdings, Pinghu Street, Longgang District, Shenzhen, Guangdong, China
Process range conditions of copper plating series
Time:
2015-06-22 16:59
Source:
1. Process conditions of acidic bright copper plating:
Copper sulfate 160-240g/L
Sulfuric acid 40-90g/L
Chloride ion 30-120mg/L
210MU cylinder opening agent 2-5mu/L
210A leveling agent 0.3-0.6ml/L
210B brightener supplement
Anode: Phosphor bronze corner (ball)
Temperature 18-38 ℃
Cathode current density 1.5-8 A/d㎡
Anode current density 0.5-3A/d㎡
Voltage 2-4V
2. Cyanide-free alkaline copper plating process range conditions:
Copper sulfate 35-45g/L
Potassium carbonate 35-45g/L
Complexing agent 160-260ml/L
Additive 20-30ml/L
Brightener 8-12ml/L
Temperature 30-50 ℃
3. Pyrophosphate bright copper plating process range conditions:
Copper pyrophosphate 75-95g/L
Potassium pyrophosphate 280-350g/L
Ammonia 1-3ml/L
Brightener 0.4-1ml/L
PH:8.5-8.9
Anode: Electrolytic copper plate (corner)
Temperature 55-60℃
Cathode current density 1-6A/d㎡
Anode current density 1-3.5A/d㎡
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